Power Assemblies
Main characteristics
Using proprietary devices as well as semiconductors and water heatsinks
High power density, high efficiency and reliability
Custom design available
Natural / forced air cooling or water cooling system
Semiconductors: Thyristors, Diodes, GTOs and IGBT’s (insulated modules and press-pack type)
Field technical support available
Connection technology both copper and aluminium
| Description | POSEICO code |
Device type | Circuit type | Main characteristics | Outline |
| Stack with single diode | 2H6.../2H9... | Diode | Diode | Natural air | A |
| Diode stack mounted in plastic container for outdoor applications |
ADP....... | Diode | Diode | Natural air | B |
| Crow bar for traction application | RCB ...... | Diode + Thyristor | Crow bar | Natural air , pulsed works | C |
| High voltage stack with diodes in serie | ASA ...... | Diode | Diodes in serie | Natural air | D |
| Thyristor stack | ASA...... | Thyristor | Controlled 3 phase rectifier | Water cooling heatsink | E |
| Three phase bridges | APR...... | Diode | Rectifier three phase bridges | Natural air | F |
| Stack with fast thyristor and forced air cooling system | ASI..... | Thyristor | Two thyristors in serie | Air forced cooling | G |
| Three phase controlled bridges | APR...... | Thyristor | Controlled 3 phase bridges | Water cooling heatsink | H |
| Inverter leg Module | AINV.. | Press pack IgbT + Fast and soft recovery diodes |
Inverter leg | Water cooling heatsink | I |
| Inverter leg Module | AINV.. | IGBT and FW Diode module |
Inverter leg | Water cooling heatsink | L |
